3D EM Solver: Empire XCcell 6.0 released

“Faster on CPUs than others on GPUs”

[two-thirds]On market since 1998, EMPIRE has always been the first choice for EM design of complex structures. IMST has now released the new version 6.00, which is even further optimized to solve huge structures, hundreds of wavelength in size.
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New speed records:

  • Cluster solver: 11200 MCells/s on 7 Intel Core i7-3960 (up to 7 x 32 GByte)
  • Single PC solver: 5600 MCells/s on Dual Intel Xeon E2690 (up to 512 GByte)
  • Single PC solver, SSD swapping: 1800 MCells/s on Intel Core i7-3960 (up to 1 TB)

New features include:

  • Thermal solver including heat sources, RF losses, conductivity, convection, radiation
  • Poser for human body models
  • High speed simulation on Solid State Disks (SSD)
  • Additional Optimizer algorithms (Global Direct, Nelder Mead, MSLS)
  • Optimization on single value goals (e.g. beamwidth, efficiency)
  • Human body thermal effects of EM radiation
  • Postprocessing (e.g. far field transformation) on remote servers
  • Field monitors for volumes, planes, paths, probes
  • Smooth display of fields on complex surfaces
  • Parameter sweep mapping to formulas or lists
  • Arbitrary oriented (off-axis) lumped ports
  • Active impedance simulation (simultaneous excitation of unequally numbered ports)
  • Enhanced field display features, e.g. markers in animations

To use the new modules (Thermal Solver, Poser), a separate license feature is required.

For more information about Empire XCcell, see the product page.
30 day evaluation versions are available, please contact us for more details.

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Application Examples

Complete HPA module for GSM and XCS

  • Simulation time: 1 min
  • Memory usage: 150 MB,
  • Size: 3 MCells
  • Dual Xeon E2690
  • DC – 5 GHz
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KA Band TX waveguide aperture radiating 32 x 32 antenna array

 

  • Simulation time: 8 min
  • Memory usage: 3.6 GB,
  • Size: 87 MCells
  • Dual Xeon E2690
  • 29.5 GHz

Sonnet 13.56: Skill Scripts for Cadence Design Flow

New utilities for Cadence design flow

In Sonnet 13.56, some new utilities have been added to support the Cadence<>Sonnet design flow. These are implemented as Skill scripts and can be customized by the user if needed.

This functionality is added by the new Skill scripts:

  • Remove unwanted polygons from SonnetEM, based on layer purpose
  • “Stop via” implementation as used for MIM-capacitors and resistors
  • Merge a meshed ground plane into a solid polygon, with cutouts for vias

All these scripts are explained in detail below.

Introduction

When creating the Sonnet EM view from the Caddence layout view, the Sonnet interface can run pre- and postprocessing scripts. This enables customized modification of the layout, to prepare it for efficient EM simulation.


(click to view full size)

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Remove unwanted polygons based on layer purpose

 

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Some designs in certain PDK’s for parasitic extraction have polygons on a non-drawing purpose such as the “ll” purpose. Without using the new script, the layer mapping from Cadence to Sonnet does not evaluate the purpose, so designers would have to delete these extra polygons manually.

In the picture below, the unwanted polygon is moved in the Sonnet editor, to show this extra polygon better.

In Sonnet 13.56, we have a new script to remove these extra polygons. The default is to keep polygons on the “drawing” purpose and the “pin” purpose. Deleting polygons only happens in the SonnetEM view and not in the original layout.

You can easily run this script when creating the SonnetEM view and pass in a list of purposes to keep.

SonnetDeletePolygonsNotWithPurpose(list("drawing" "pin"))
SonnetDeletePolygonsNotWithPurpose()

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(click to view full size)[/half]

 

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Stop via implementation

 

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In some technologies, the same via layer is user to connect to different metal layers. This is sometimes found in MIM capacitors or resistors. In the example below, you can see that VIA3 connects to Metal3 or MIM, depending on the presence of the MIM metal layer.

In Sonnet 13.56, we have a new script to handle this situation.

This simple script will move the polygons on the via drawing layer connecting to the MIM layer to a temporary drawing layer for translation purposes. In the Cadence to Sonnet layer mapping , we can then use that new via to connect to the MIM layer.

Of course, moving of polygons only happens in the SonnetEM view and not in the original layout.

You can easily run this script when creating the SonnetEM view and pass in the appropriate layer purpose pairs. Syntax is to pass in the layer purpose pair (LPP) of the MIM layer, then the via LPP connecting to the MIM and finally the new temporary via LPP

IMPORTANT: When using the script, the .matl file needs to be edited so that the new temporary drawing layers used are mapped properly.

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(click to view full size)[/half]
SonnetMoveSingleMimCapVias(list(“MIM” “drawing”) list(“Via3” “drawing”) list(“TempVia3” “drawing”))

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Simplify meshed ground plane

 

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Due to layout rules, large ground planes are often implemented by a mesh of lines, instead of a filled area. Electrically, this mesh will behave very similar to a filled area. The filled area representation is much more efficient for EM simulation. By using a new script, we can now convert the meshed area to a filled area, for much faster simulation.

This new script will simplify a ground plane, but leave the required keep out areas for pins and vias.

Technically, this script will grow all of the metal on certain drawing layers, merge them all together and then shrink all of the metal back to its original size. Merging of polygons only happens in the SonnetEM view and not in the original layout. You can easily run this script when creating the SonnetEM view and pass in the appropriate layer purpose pairs.

Syntax is to pass in the layer purpose pair (LPP) of the ground layer which you want to merge and then a LPP that is used to temporarily move the polygons to in the algorithm.[/half]

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(click to view full size)[/half]

SonnetMergeMeshGndPlane(list(“Metal1” “drawing”) list(“TempMetal1” “drawing”))

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Installing the new scripts

The Skill scripts are located in <SONNET_DIR>/sonnet_virtuoso_dk/skillutil.

It’s best to install these scripts after the interface is installed in the .cdsinit file so that they are easily available for use. Just load in the .il files that you might be interested in using and the parameters can be passed into each function when creating the SonnetEM view.

aSonnetDir = getShellEnvVar("SONNET_DIR") 
;// Loads the Sonnet Move Single MIM Cap Vias Utility
loadi(simplifyFilename(strcat(aSonnetDir "/sonnet_virtuoso_dk/skillutil/sonnetmovesinglemimcapvias.il"))) 
;// Loads the Sonnet Move Dual MIM Cap Vias Utility
loadi(simplifyFilename(strcat(aSonnetDir "/sonnet_virtuoso_dk/skillutil/sonnetmovedualmimcapvias.il"))) 
;// Loads the Sonnet Move Resistor Vias Utility
loadi(simplifyFilename(strcat(aSonnetDir "/sonnet_virtuoso_dk/skillutil/sonnetmoveresistorvias.il"))) 
;// Loads the Sonnet Delete Polygons Not With Purpose Utility
loadi(simplifyFilename(strcat(aSonnetDir "/sonnet_virtuoso_dk/skillutil/sonnetdeletepolygonsnotwithpurpose.il"))) 
;// Loads the Sonnet Mesh Ground Plane Utility
loadi(simplifyFilename(strcat(aSonnetDir "/sonnet_virtuoso_dk/skillutil/sonnetmergemeshgndplane.il")))

 

Sonnet 13.56 now available

Sonnet Professional 13.56

This release provides a number of changes in the Sonnet Interfaces and also contains a beta of the new Inductor Model Extractor which will be introduced in release 14 of Sonnet. Please see below for details.

 

Compatibility with ADS 2011

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Sonnet’s Agilent ADS Interface now supports Agilent’s ADS 2011 version.

For information on using Sonnet’s Agilent ADS Interface with ADS 2011, please refer to the Sonnet’s Agilent ADS Interface Release 13 Update document included in your release. Select Help > Manuals from any Sonnet application, then click on the link for the Translators. For the most up to date compatibility requirements, please see http://www.sonnetsoftware.com/requirements.

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Inductor Model Extractor beta

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Sonnet version 13.56 introduces the beta version of a new Inductor Model Extractor feature which allows you to output an equivalent circuit model for an inductor with a “Skin Effect” topology. The inductor model may be output as a Spectre or PSpice data file, or a Sonnet netlist. You may set up this output before analysis in the project editor or create the file in the response viewer after your analysis is complete.

For more information on enabling and using this beta feature, please see the documentation available on our web site at http://www.sonnetsoftware.com/beta.

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Enhanced Cadence Interface

For information on the changes in Sonnet’s Cadence Virtuoso Interface, please see the Sonnet’s Cadence Virtuoso Interface Release 13 Update document included in your release. Select Help > Manuals from any Sonnet application, then click on the link for the Translators.

Bug fixes and known bugs

Check the Sonnet web site for the latest information and the most up to date list of known bugs and bug fixes: http://www.sonnetsoftware.com/release-notes

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Updated  .matl file documentation

This release includes an updated documentation of the Sonnet process file (.matl) format to add missing entries and correct mistakes in the .matl File Format appendix in the release 13 Translators manual.

The information in the .matl File Format document supersedes the information in the appendix. Select Help > Manuals from any Sonnet application, then click on the link for the Translators to access this document.

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[half][box type=info]Sonnet 13.56 download information[/box][/half]

[half][box type=info]What’s new in Sonnet 13.56[/box][/half]

 

New Version of m/matl EM Technology File Editor

We have released a major update for the m/matl EM Technology File Editor.

New and updated in the 25. Jan 2012 release:

  • Major new revision with new user interface and new functionality
  • Support for multiple metals on the same level, with proper visualization
  • Import *.son model
  • Export *.son model for stand alone use
  • Manage and export layer mappings for GDSII and DXF workflow,
    to enable multi-design-flow support from a single source file
  • Many details updated for better improved usability
  • User’s Guide in PDF format included

https://muehlhaus.com/material-file-utility

New application note: Stacked Metal

Stacked Metal in Sonnet Inductor Models

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The purpose of this document is to assist you with simulation of inductors that have stacked metal, connected by large via array.

via meshing

Often, these via arrays cover the entire conductor area, making the analysis slow and take much memory. We will investigate the physical behaviour of the via array at high frequency, and derive better modelling techniques that are more efficient in terms of simulation time and memory.

[box type=info]RFIC Stacked Metal in Sonnet (PDF, 892kB)[/box]

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New application note: Inductor Measured vs. Simulated

RFIC Inductor Measured vs. Simulated Troubleshooting

[two-thirds] The purpose of this document is to assist you with resolving possible differences between simulated RFIC inductor results and values obtained from the design kit or from measurement.

Inductor lumped model

This document is based on extensive practical experience. The author has worked for many years in RFIC inductor modelling, and worked closely with the modelling and measurement groups of different foundries.

[box type=info]RFIC Inductor Measured vs Simulated (PDF, 540kB)[/box]

Updated 31. Jan 2012:
Added description how to calculate differential L and differential Q
from 2-port and 3-port simulations. Below is the Sonnet equation file.

[box type=info]Differential inductor equations Ldiff and Qdiff (ZIP, 1kB) [/box]

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Empire XCcell 3D EM: Faster on CPUs than others on GPUs

EMPIRE XCcel 5.51 released

 

[two-thirds]Recent benchmark results again demonstrated the unbelievable speed of EMPIRE XCcel. EMPIRE features the XPU technology which is a unique software driven workflow among CPUs – invented at IMST. As shown here, EMPIRE’s performance on a single PC is much higher than using a graphic card solution.[/two-thirds] [third] [/third]

 

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In addition the performance is nearly independent from the structure size. In contrast to solutions which make use of graphic card accelerators (GPU) EMPIRE XCcel allows the usage of the complete built-in memory. On a 64 bit operation system up to 192 GByte can be used today with the full simulation performance.

For even larger sizes EMPIRE XCcel’s recently developed Cluster solution is available and proven to yield perfromances which scale linearily with number of clustered PCs. The new 5.51 release is even further optimised to solve huge structures hundreds of wavelength in size.[/two-thirds] [third] [/third]

New features include:

  • SAR compliance to standard P1528
  • Active impedance calculation
  • Tensoric Debye materials
  • User requested 2D plot enhancements
  • Far field coverage display
  • Accelerations for pre- and postprocessing
  • Improved import/export filters (gerber, dxf), export of SAT format
  • Periodic field output synchronization

[two-thirds]*12 port Multifeed, cubic growth, including losses, PGA, observation; >400 MCells: 2xXeon 5580, 48 GB
XPU is an innovative proven software controlled workflow among CPUs – invented at IMST[/two-thirds] [third] [/third]

Sonnet 13.54 Tips & Tricks

Tips & Tricks

Sonnet 13.54 was just released, and includes some new capabilities that we want to discuss here.

Via array merging

You might know that Sonnet 13 can merge via arrays during import, creating one big via that is more efficient to simulate. This feature is available for the Cadence interface, Agilent ADS interface and AWR Microwave office interface,  as well as DXF and GDSII import.

Via merge in GDSII import

Via merge in GDSII import

Unfortunately, via arrays in existing projects can not be merged in the Sonnet editor, but there is a workaround: in the <SONNET_DIR>/bin directory, there is a commandline program viamerge.exe that can modify an existing simulation model and merge the vias.

If viamerge.exe is called with a project name as the only parameter, it will read that model and overwrite it with the modified version. If you supply a second filename, then the original file is untouched and the modified file is written into the second file.

viamerge mergeme.son
viamerge input.son output.son

In the next section, we will learn how this command can be called from the Sonnet menu, using the new customized menu feature.

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Custom menu

In Sonnet 12.54, a new “customized menu” feature was introduced. This enables the user to define an additional, customized menu entry in xgeom and other Sonnet tools.

Customized menu in xgeom

Customized menu in xgeom (click to view full size)

Users can add one customized menu entry for each of the Sonnet tools, with customized commands or calls to external programs. This can be useful to send Sonnet projects to home-made simulation cluster scripts, run external pre- or postprecessing tools on the current project, and much more.

To define the custom menu shown above, the custom menu has been enabled for the xgeom to0l by adding the folling line to the [xgeom] section of the sonnet.ini file:

CustomMenu=$SONNET_APPDATA_DIR\data\custom_menu.xml

This points to the file custom_menu.xml, which we have created in the Sonnet application data directory C:\ProgramData\Sonnet Software\13.54

<?xml version=”1.0″ standalone=”yes”?>
<custom_menu name=”Custom”>

<menu_item name=”Editor”>
<exe> c:\windows\system32\notepad.exe </exe>
<arguments>  $PROJECT </arguments>
</menu_item>

<menu_item name=”Merge Vias”>
<exe>    $SONNET_DIR\bin\viamerge.exe  </exe>
<arguments>$PROJECT merged.son</arguments>
</menu_item>

</custom_menu>

This is a simple file, with two commands to call external programs. The first command opens the currently open Sonnet project in the notepad editor that is part of the Windows operating system. As you can see, the commandline via merging utility viamerge.exe is included as another custom command, with the currently open Sonnet project as the first parameter (=input file) and the fixed filename merged.son as the second parameter (=output file).

The full, official documentation of the custom menu feature is available here: Sonnet_Custom_Menu_R13

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Display equations for transformers

We have created some equations for the Sonnet data display, to assist you with the analysis of transformers.
These equations can be used with transformers where the primary is connected with ports 1/-1 and the secondary is connected with ports 2/-2. The equations can not be used with transformers analyzed in 4-port configuration.

transfomer with differential ports

 

The equation file includes the following equations:

  • Coupling factor k
  • Transformer ratio n
  • Inductance with other ports open
  • Resistance with other ports open
  • Q factor with other ports open

These equations are required because the standard Q factor, Inductance1/2 and Resistance1/2 equations are calculated from Y parameters, which means that other ports are shorted. This is not useful for our two-port transfomer case, so we have defined our own transformer equations.

Download transformer_equations file (ZIP)

Please refer to the Sonnet User’s Guide on how to load equation files.

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Technology utility to create matl files

Mühlhaus GmbH has created a new material file utility to help RFIC users with the setup of complex stackups.

At the present time, this tool writes out *.matl files for the Cadence and Agilent interface. You can define stackups starting from an empty file, or import existing files in Sonnet *.matl format and Agilent *.slm format.

The stackup can be visually inspected in different views. Material data input can be in Sonnet format (thickness and conductivity) or the data as typically found in foundry data sheets (thickness and ohm/square).

Material file tool

Material file tool - cross section view (click for full size)

Material file tool - metal property view

Material file tool - metal property view (click for full size)

Dielectric layers also can be merged, creating a new dielectric with the total height and the effective epsilon.

Merging of dielectrics

Merging of dielectrics (click for full size)

The tool is available to Mühlhaus Consulting & Software GmbH customers at no extra cost. Please contact us to receive the files.